Richard J. & Joan M. Meister Endowed Scholarship for Community-based Service Learning

The Richard J. Meister Scholarship lies in the tradition of DePaul scholars who critically reflect on societal issues and problem solving methods to achieve societal goals and engage in service within the local and/or global community.

The Irwin W. Steans Center for Community-based Service Learning at DePaul University invites current DePaul students to apply for the Richard J. Meister Scholarship. The Meister Scholarship is an award of $1,500 for DePaul University students for the 2023-2024 academic year. Applicants should have prior experience doing community-based work, assisting individuals served by community-based organizations, advocating for causes, or other experience that demonstrates commitment to civic engagement. All DePaul students are eligible, with a special consideration for students ages 25 and older.

Steans Center - General Scholarships
Supplemental Questions
  1. Please upload a current resume that demonstrates your commitment to issues of social justice, community service and responsibility, and academic excellence.
  2. Please upload a cover letter (not to exceed one page) that describes how you heard about the scholarship, details your background, and explains why you feel you are the right fit for the scholarship.
  3. Please upload your latest Unofficial DePaul University Transcript for coursework verification. You can find your unofficial transcript through: Campus Connect ---> Academic Records --->View Unofficial Transcript.
  4. In no more than 400 words, please describe your prior experience doing community-based work, assisting individuals served by community-based organizations, advocating for causes, or other experiences that demonstrate your commitment to civic engagement. What is your motivation for doing such work, and how do you see this work contributing to addressing issues of social inequality and/or social injustice?
  5. In a maximum of 300 words, please describe your career and professional goals. What role will your DePaul education play in helping you achieve these goals? How will your service and/or advocacy work contribute to these future goals?
  6. Please provide any additional information you feel is relevant to demonstrating your commitment to civic engagement.
  7. Please request a letter of recommendation from a DePaul University faculty member who can comment on your character and academic performance. Please enter the name and e-mail of your reference to send the request.
  8. Please request a letter of recommendation from someone who can comment on your contribution to your community. Please enter the name and e-mail of your reference.
  9. Scholarship Connect Student Consent
    • A) Consent Statement

      By clicking the checkbox below, I certify that all the information provided as part of the scholarship application process is accurate. I understand that as part of the scholarship application and selection process, my academic information, financial aid information, and other demographic information may be shared with individuals who are involved in the scholarship selection process and recipient reporting. This may include information from my Free Application for Federal Student Aid (FAFSA), my annual award information, my Cost of Attendance components (living expenses, personal expenses, travel, books, tuition, and fees), and items related to my current academic standing and career program. By agreeing to this electronically, I am authorizing DePaul University, and providing my consent, to release my information and allowing me to be considered for scholarship opportunities. I understand that if I do not agree to this release, I will be unable to proceed with my scholarship application. I further understand that by completing the signature below and selecting the “Finish and Submit” button in this electronic application, I am signing and acknowledging my consent. My submitted signature in this electronic application has the same legal effect, validity, and enforceability as affixing my signature to a paper document. I also acknowledge that my financial aid information is being released with my explicit written authorization as allowed by the Higher Education Act (HEA), HEA 483(a)(3)(E), affirmed by Congress in the final fiscal year 2018 omnibus spending bill, HEA 485B, 494, the IRC 26 USC 6103(I)(13) and HEA 20 USC 1098h(c)(2) .
    • B) Consent Statement Electronic Signature
    • C) Signature Date
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