Warren and Jennifer Schultz Endowed Study Abroad Fund

For Academic Year 2023-2024

Please note that this application is for qualified applicants enrolled in a DePaul-sponsored study abroad program.

Applications are due February 1 for Summer programs and May 1 for December programs. Awards are $1,000+ each and can be applied to any DePaul-sponsored study abroad program in that term.

This endowed scholarship provides recognition and financial assistance to students enrolled in the College of Liberal Arts and Social Sciences who are majoring in History, are in good academic standing, have financial need and are participating in a DePaul-sponsored study abroad program. The Donors’ intent is for this fund to be used to offset study abroad program fees.

Supplemental Questions
  1. Explain how this program and its coursework will impact your personal and/or academic goals. Be as specific as possible. You can use the exact same text you used on your study abroad program application (about 250 words).
  2. Scholarship Connect Student Consent
    • a) Consent Statement

      By clicking the checkbox below, I certify that all the information provided as part of the scholarship application process is accurate. I understand that as part of the scholarship application and selection process, my academic information, financial aid information, and other demographic information may be shared with individuals who are involved in the scholarship selection process and recipient reporting. This may include information from my Free Application for Federal Student Aid (FAFSA), my annual award information, my Cost of Attendance components (living expenses, personal expenses, travel, books, tuition, and fees), and items related to my current academic standing and career program. By agreeing to this electronically, I am authorizing DePaul University, and providing my consent, to release my information and allowing me to be considered for scholarship opportunities. I understand that if I do not agree to this release, I will be unable to proceed with my scholarship application. I further understand that by completing the signature below and selecting the “Finish and Submit” button in this electronic application, I am signing and acknowledging my consent. My submitted signature in this electronic application has the same legal effect, validity, and enforceability as affixing my signature to a paper document. I also acknowledge that my financial aid information is being released with my explicit written authorization as allowed by the Higher Education Act (HEA), HEA 483(a)(3)(E), affirmed by Congress in the final fiscal year 2018 omnibus spending bill, HEA 485B, 494, the IRC 26 USC 6103(I)(13) and HEA 20 USC 1098h(c)(2) .
    • b) Consent Statement Electronic Signature
    • c) Signature Date