Lake County Bar Foundation Scholar

To provide recognition and financial assistance to College of Law students who have a connection to Lake County, Illinois, including but not limited to having grown up, residing, working, or having family in the county, and admittance to the College of Law.

Award
Varies
Deadline
08/18/2026
Supplemental Questions
  1. Please write a brief essay (800-1200 words) answering the following questions: 1) Please describe your connection to Lake County, IL. 2) If selected, how would receiving the Lake County Bar Foundation scholarship help you achieve your educational and career goals? 3) Can you attend an in-person event in Lake County, IL? The Foundation plans to hold a reception with the scholars the evening of Thursday March 12th, 2026, at the LCBA building.
  2. Please upload your current CV/Resume.
  3. Please upload an unofficial transcript
  4. Scholarship Connect Student Consent
    • A) Consent Statement

      By clicking the checkbox below, I certify that all the information provided as part of the scholarship application process is accurate. I understand that as part of the scholarship application and selection process, my academic information, financial aid information, and other demographic information may be shared with individuals who are involved in the scholarship selection process and recipient reporting. This may include information from my Free Application for Federal Student Aid (FAFSA), my annual award information, my Cost of Attendance components (living expenses, personal expenses, travel, books, tuition, and fees), and items related to my current academic standing and career program. By agreeing to this electronically, I am authorizing DePaul University, and providing my consent, to release my information and allowing me to be considered for scholarship opportunities. I understand that if I do not agree to this release, I will be unable to proceed with my scholarship application. I further understand that by completing the signature below and selecting the “Finish and Submit” button in this electronic application, I am signing and acknowledging my consent. My submitted signature in this electronic application has the same legal effect, validity, and enforceability as affixing my signature to a paper document. I also acknowledge that my financial aid information is being released with my explicit written authorization as allowed by the Higher Education Act (HEA), HEA 483(a)(3)(E), affirmed by Congress in the final fiscal year 2018 omnibus spending bill, HEA 485B, 494, the IRC 26 USC 6103(I)(13) and HEA 20 USC 1098h(c)(2) .
    • B) Consent Statement Electronic Signature
    • C) Signature Date