Charles H. Wurtzebach, PhD and Susan M. Marshall Endowed Scholarship

Business – Awarded to students with a GPA of 3.0+ attending one or more not-for-profit real estate association meetings to offset travel and conference expenses.

This scholarship requires you to upload a copy of your unofficial transcript. If you have not already done so, please go back to the General Application to upload.

For additional information about this scholarship or the application process, please contact orios@depaul.edu

Award
Varies
Scopes
Driehaus College of Business - Real Estate Center
Deadline
08/09/2026
Supplemental Questions
  1. Submit your current resume.
  2. Why have you chosen real estate as a major?
  3. In a one page, single-spaced essay, please describe to the scholarship committee your career plans and why you chose real estate for your academic career.
  4. Are you willing to travel to attend one of the following conferences (Award covers airfare, conference registration and hotel ONLY): ULI, PREA, NAREIT, CRE or ICSC?
  5. Please upload your latest Unofficial DePaul University Transcript for coursework verification. You can find your unofficial transcript through: Campus Connect ---> Academic Records --->View Unofficial Transcript.
  6. Scholarship Connect Student Consent
    • A) Consent Statement

      By clicking the checkbox below, I certify that all the information provided as part of the scholarship application process is accurate. I understand that as part of the scholarship application and selection process, my academic information, financial aid information, and other demographic information may be shared with individuals who are involved in the scholarship selection process and recipient reporting. This may include information from my Free Application for Federal Student Aid (FAFSA), my annual award information, my Cost of Attendance components (living expenses, personal expenses, travel, books, tuition, and fees), and items related to my current academic standing and career program. By agreeing to this electronically, I am authorizing DePaul University, and providing my consent, to release my information and allowing me to be considered for scholarship opportunities. I understand that if I do not agree to this release, I will be unable to proceed with my scholarship application. I further understand that by completing the signature below and selecting the “Finish and Submit” button in this electronic application, I am signing and acknowledging my consent. My submitted signature in this electronic application has the same legal effect, validity, and enforceability as affixing my signature to a paper document. I also acknowledge that my financial aid information is being released with my explicit written authorization as allowed by the Higher Education Act (HEA), HEA 483(a)(3)(E), affirmed by Congress in the final fiscal year 2018 omnibus spending bill, HEA 485B, 494, the IRC 26 USC 6103(I)(13) and HEA 20 USC 1098h(c)(2) .
    • B) Consent Statement Electronic Signature
    • C) Signature Date
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