Dania Guzman y Guzman Endowed Scholarship in Latin American and Latino Studies

The purpose of this endowed fund shall be to provide recognition and financial assistance to students enrolled in a program in the Latin American and Latino Studies department in the College of Liberal Arts and Social Sciences who are in good academic standing and have financial need. This endowment is in honor of Dania Guzman y Guzman, a high school exchange student from Mexico who came to live with the donor. They formed a life-long relationship with each other and their families.

This scholarship is renewable for three years or through the recipient’s senior year, whichever comes first. The scholarship will not renew for another year if the student extends beyond their initial senior year.

Award
Varies
Scopes
College of Liberal Arts and Social Sciences
Deadline
11/01/2026
Supplemental Questions
  1. In 250 words or less, please describe the impact of your LALS major/minor in your academic and vocational endeavors
  2. Scholarship Connect Student Consent
    • A) Consent Statement

      By clicking the checkbox below, I certify that all the information provided as part of the scholarship application process is accurate. I understand that as part of the scholarship application and selection process, my academic information, financial aid information, and other demographic information may be shared with individuals who are involved in the scholarship selection process and recipient reporting. This may include information from my Free Application for Federal Student Aid (FAFSA), my annual award information, my Cost of Attendance components (living expenses, personal expenses, travel, books, tuition, and fees), and items related to my current academic standing and career program. By agreeing to this electronically, I am authorizing DePaul University, and providing my consent, to release my information and allowing me to be considered for scholarship opportunities. I understand that if I do not agree to this release, I will be unable to proceed with my scholarship application. I further understand that by completing the signature below and selecting the “Finish and Submit” button in this electronic application, I am signing and acknowledging my consent. My submitted signature in this electronic application has the same legal effect, validity, and enforceability as affixing my signature to a paper document. I also acknowledge that my financial aid information is being released with my explicit written authorization as allowed by the Higher Education Act (HEA), HEA 483(a)(3)(E), affirmed by Congress in the final fiscal year 2018 omnibus spending bill, HEA 485B, 494, the IRC 26 USC 6103(I)(13) and HEA 20 USC 1098h(c)(2) .
    • B) Consent Statement Electronic Signature
    • C) Signature Date