Malik T. Murray Endowed Internship for Emerging Finance Professionals

The Malik T. Murray Endowed Internship for Emerging Finance Professionals provides a DePaul undergraduate student with an experiential learning opportunity in the University’s Office of the Treasurer and scholarship support during Spring Quarter 2027. Established in memory of DePaul alumnus and Trustee Malik T. Murray, the fund honors his legacy of mentorship, opportunity, and giving back.

Through this application, one student will be selected to participate in the internship and receive the associated scholarship. The opportunity is designed to help the selected student connect academic coursework with professional experience and develop skills relevant to a career in finance.

For the inaugural Spring Quarter 2027 internship, applicants must:

  • Be a declared Finance major in the Driehaus College of Business with junior or senior standing.
  • Have a minimum cumulative GPA of 3.3.
  • Have completed courses FIN 310 and FIN 311 by the time of application.
  • Have either completed FIN 330 or be enrolled in FIN 330 during Fall Quarter 2026.

Preference may be given to applicants who are first-generation college students, demonstrate financial need, or have overcome significant personal, social, or educational challenges. Applicants are strongly encouraged to complete and submit the DePaul University General Application in Scholarship Connect. The General Application provides students with an opportunity to self-report information related to these preference criteria and may be used by the review committee when considering applicants for this opportunity.

Applications will be accepted October 12 – November 9, 2026, through DePaul Scholarship Connect. Finalists will be invited to interview with the review committee between mid-November and early December. Fall Quarter academic performance, including completion of applicable Finance coursework, may be considered as part of the final review. Final selection is anticipated in mid-December.

Award
$2200+
Scopes
Driehaus College of Business - Department of Finance
Deadline
11/09/2026
Supplemental Questions
  1. Have you completed FIN 310 and FIN 311?
  2. Please indicate your current status for FIN 330.
  3. In 300 words or fewer, please describe your interest in the Malik T. Murray Endowed Internship for Emerging Finance Professionals and the opportunity to work in DePaul University’s Office of the Treasurer. You may wish to address how the internship relates to your academic interests, professional goals, or interest in gaining practical experience in finance.
  4. Finalists for this opportunity will be invited to participate in an interview with the review committee between mid-November and early December. If selected as a finalist, are you willing to participate in an interview as part of the selection process?
  5. Final selection is expected to occur after Fall Quarter 2026 grades are available. Fall Quarter academic performance, including performance in applicable Finance coursework, may be considered as part of the final review. Please confirm that you understand and agree to this condition.
  6. Scholarship Connect Student Consent
    • A) Consent Statement

      By clicking the checkbox below, I certify that all the information provided as part of the scholarship application process is accurate. I understand that as part of the scholarship application and selection process, my academic information, financial aid information, and other demographic information may be shared with individuals who are involved in the scholarship selection process and recipient reporting. This may include information from my Free Application for Federal Student Aid (FAFSA), my annual award information, my Cost of Attendance components (living expenses, personal expenses, travel, books, tuition, and fees), and items related to my current academic standing and career program. By agreeing to this electronically, I am authorizing DePaul University, and providing my consent, to release my information and allowing me to be considered for scholarship opportunities. I understand that if I do not agree to this release, I will be unable to proceed with my scholarship application. I further understand that by completing the signature below and selecting the “Finish and Submit” button in this electronic application, I am signing and acknowledging my consent. My submitted signature in this electronic application has the same legal effect, validity, and enforceability as affixing my signature to a paper document. I also acknowledge that my financial aid information is being released with my explicit written authorization as allowed by the Higher Education Act (HEA), HEA 483(a)(3)(E), affirmed by Congress in the final fiscal year 2018 omnibus spending bill, HEA 485B, 494, the IRC 26 USC 6103(I)(13) and HEA 20 USC 1098h(c)(2) .
    • B) Consent Statement Electronic Signature
    • C) Signature Date
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